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bu21072muv product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 1/14 tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 14 ? 001 capacitive controller ics capacitive switch controller ics bu21072muv / BU21078MUV key specifications input voltage range operating temperature range operating current scan rate 3.0 to 3.6v (typ.) -25 to 85 (typ.) 3.5ma (typ. without load) 16msec (typ.) general description bu21072muv/BU21078MUV is a capacitive sensor controller for switch operation. in addition to a regular simple switch, support matrix switches which are arranged in the matrix sensors. if external noise and temperature drift are detected, the automatic self-calibration is operated. include led controller with pwm function. features 10 capacitive sensor ports. (bu21072muv) 12 capacitive sensor ports. (BU21078MUV) supported matrix switches. maximum 16 switches. (bu21072muv) maximum 36 switches. (BU21078MUV) automatic self-calibration. held touch detection. led controller with pwm function. inform the detected result of switch operation by interrupt. 2-wire serial bus interface. 3.3v single power supply. built-in power-on-reset and oscillator. applications appliance that require multiple switches. information appliance as printer. av appliance as digital tv and hdd recorder. notebook pc. packages bu21072muv : vqfn024v4040 4.00 L 4.00 L 1.00 L BU21078MUV : vqfn028v5050 5.00 L 5.00 L 1.00 L vqfn024v4040 vqfn028v5050 typical application circuit fig.1 typical application circuit
2/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 overview bu21072muv/BU21078MUV is a capacitive sensor controller for switch operation. included blocks are afe (analog front end) detecting capacit ance, a/d converter, mpu, led ports with pwm function, 2-wire serial bus interface compatible with i2c protocol, power-on-reset, oscillator. operate with a 3.0 to 3.6v single power supply. the results that detected switch operations (touch/release/hold) are held to each register. an interrupt is send from int port to the host when a register is updated by detected operat ions. if external noise and temperature drift are detected, run automatic self-calibration. without periodical polling, offer the reduction of the host load. led ports are able to be applied pwm function. pwm function offers fade-in / fade-out brightness control. simple switch one sensor is assigned to one switch. each simple switch has the registers of detected touch/release/hold operations. simple switches support to multi-detect touch/rele ase/hold. unused simple switches are maskable. matrix switches the cross points of the sensors which are arranged in a matrix are able to assigned to individual switches. each matrix switch has the registers of detected touch/release/hold operations. matrix switches do not support to multi-detect touch/release/hold. not used matrix switches are maskable. bu21072muv supports 16 matrix switches configured by 4x4 sensors, and BU21078MUV supports 36 matrix switches configured by 6x6 sensors. automatic self-calibration bu21072muv/BU21078MUV has observed the situation surrounding the sensor based on the detection result. if external noise and temperature drift are detected, the automatic self-calibration is operated for the stable detection result. led controller with pwm timers led controller is high active. each led port is assigned to a choice of four pwm timers. if the situation surrounding the sensor is changed by the switching led, it is useable that calibration is operated by sending led control command. host interface bu21072muv/BU21078MUV is slave device for the host device. 2-wire serial bus is compatible with i2c protocol. slave address : 0x5c(bu21072muv) , 0x5d(BU21078MUV) pin configurations sin12 sin2 sin11 sin1 sin0 avdd led7 led6 led5 led4 led3 led2 vdd led1 fig.2 pin configuration of bu21072muv fig.3 pin configuration of BU21078MUV
3/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pin descriptions i/o equivalence circuits pad cin i vdd oen fig.4 i/o equivalence circuit (a) fig.5 i/o equivalence circuit (b) fig.6 i/o equivalence circuit (c) bu21072muv BU21078MUV - 1 sin12 ain capacitive touch sensor 12 avdd hi-z fig.4 2 2 sin2 ain capacitive touch sensor 2 avdd hi-z fig.4 - 3 sin11 ain capacitive touch sensor11 avdd hi-z fig.4 3 4 sin1 ain capacitive touch sensor 1 avdd hi-z fig.4 4 5 sin0 ain capacitive touch sensor 0 avdd hi-z fig.4 5 6 avdd power ldo output for analog blocks vdd - - 67vddpowerpower --- 7 8 dvdd power ldo output for digital blocks vdd - - 89vssgndground --- 9 10 test in test input must be tied to ground vdd - fig.5 10 11 scl inout host i/f clock input vdd hi-z fig.5 11 12 sda inout bi-directional host i/f data vdd hi-z fig.5 12 13 int out interrupt output active high interrupt vdd "l" fig.6 13 14 led0 out led control with pwm output 0 active high vdd hi-z fig.6 14 15 led1 out led control with pwm output 1 active high vdd hi-z fig.6 15 16 led2 out led control with pwm output 2 active high vdd hi-z fig.6 16 17 led3 out led control with pwm output 3 active high vdd hi-z fig.6 17 18 led4 out led control with pwm output 4 active high vdd hi-z fig.6 18 19 led5 out led control with pwm output 5 active high vdd hi-z fig.6 - 20 led6 out led control with pwm output 6 active high vdd "l" fig.6 - 21 led7 out led control with pwm output 7 active high vdd "l" fig.6 19 - sin9 ain capacitive touch sensor 9 avdd hi-z fig.4 20 - sin8 ain capacitive touch sensor 8 avdd hi-z fig.4 21 22 sin7 ain capacitive touch sensor 7 avdd hi-z fig.4 22 23 sin6 ain capacitive touch sensor 6 avdd hi-z fig.4 - 24 sin13 ain capacitive touch sensor 13 avdd hi-z fig.4 23 25 sin5 ain capacitive touch sensor 5 avdd hi-z fig.4 - 26 sin14 ain capacitive touch sensor 14 avdd hi-z fig.4 24 27 sin4 ain capacitive touch sensor 4 avdd hi-z fig.4 1 28 sin3 ain capacitive touch sensor 3 avdd hi-z fig.4 note power initial condition i/o equivalence circuit number name type function initial condition is at that power-on-reset is active.
4/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram description of blocks sensor afe, c/v converter convert from capacitance to voltage following the order of sensors. a/d convert from voltage to the detected result the digital value. ldo28 2.73v output ldo for sensor afe, c/v converter and a/d. ldo15 1.5v output ldo for osc and digital blocks. osc ring oscillator as the system clock. por power-on-reset monitoring vdd as the system reset. mpu based on the detection result, detect switch operations (touch/release/hold) and run auto-calibration. inform by the int port to the host about that the switch operations are detected. control led ports by the commands from the host. prom program rom for the included mpu. wram work ram for the included mpu. host i/f 2-wire serial bus interface compatible with i2c protocol. afe_cnt sequencer of sensor afe, c/v converter and a/d. pwm_cnt pwm timers for the led ports. leddrv led port drivers. wdtr watchdog timer reset. it releases the system reset after 1 sec from that mpu cannot clear wdtr. (if mpu cannot clear wdtr, mpu is hang-up.) fig.7 block diagram
5/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta = 25 ) parameter symbol rating unit power supply voltage vdd -0.5 to 7.0 v input voltage v in -0.5 to vdd + 0.3 v storage temperature range t stg -55 to 125 bu21072muv 272 *1 power dissipation BU21078MUV p d 304 *2 mw maximum junction temperature t jmax 125 *1 derated by 2.72mw/ over 25 . (ic only). *2 derated by 3.04mw/ over 25 . (ic only). recommended operating ratings parameter symbol rating unit power supply voltage vdd 3.0 to 3.6 v operating temperature range t opr -20 to 85 electrical characteristics (ta = 25 , vdd = 3.3v , vss = 0v) rating parameter symbol min. typ. max. unit condition input high voltage v ih vdd x 0.7 - vdd + 0.3 v input low voltage v il vss - 0.3 - vdd x 0.3 v output high voltage v oh vdd - 0.5 - vdd v i oh = -4ma output low voltage v ol vss - vss + 0.5 v i ol = 4ma oscillator clock frequency f osc 45 50 55 mhz dvdd ldo output voltage v dvdd 1.35 1.50 1.65 v avdd ldo output voltage v avdd 2.63 2.73 2.83 v power-on-reset release voltage 2.25 - 2.55 v power-on-reset detect voltage 2.10 - 2.40 v operating current i dd - 3.5 - ma without load of sensors.
6/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 timing charts host interface 2-wire serial bus. compatible with i2c protocol. supports slave mode only. slave address = 0x5c (bu21072muv) slave address = 0x5d (BU21078MUV) supports standard-mode (data transfer rate of 100 kbit/s) and fast-mode (data transfer rate of 400 kbit/s). supports sequential read. start sda scl stop address r/w ack ack ack data data standard-mode fast-mode parameter symbol min max min max unit hold time (repeated) start condition f scl 0 100 0 400 khz low period of the scl clock t hd;sta 4.0 - 0.6 - usec high period of the scl clock t low 4.7 - 1.3 - usec data hold time t high 4.0 - 0.6 - usec data set-up time t hd;dat 0.1 3.45 0.1 0.9 usec set-up time for a repeated start condition t su;dat 0.25 - 0.1 - usec set-up time for stop condition t su;sta 4.7 - 0.6 - usec bus free time between a stop and start condition t su;sto 4.0 - 0.6 - usec hold time (repeated) start condition t buf 4.7 - 1.3 - usec fig.9 2-wire serial bus timing chart fig.8 2-wire serial bus data format sda scl start address ack data data ack stop nack / ack r/w
7/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 s t a r t w r i t e a c k a c k a c k s t o p sssssss rrrrrrrr wwwwwwww aaaaaaa aaaaaaaa dddddddd 6543210 76543210 76543210 s t a r t w r i t e a c k a c k s t a r t r e a d a c k n a c k s t o p sssssss rrrrrrrr sssssss rrrrrrrr aaaaaaa aaaaaaaa aaaaaaa dddddddd 6543210 76543210 6543210 76543210 s t a r t w r i t e a c k a c k s t a r t r e a d a c k a c k a c k n a c k s t o p sssssss rrrrrrrr sssssss rrrrrrrr r r rrrrrrrr aaaaaaa aaaaaaaa aaaaaaa dddddddd d d dddddddd 6543210 76543210 6543210 76543210 7 0 76543210 read data from register (register address = n+x) slave address =0x5c (bu21072muv) =0x5d ( BU21078MUV ) slave address =0x5c (bu21072muv) =0x5d ( BU21078MUV ) register address (n) slave address =0x5c (bu21072muv) =0x5d ( BU21078MUV ) read data from register (register address = n) write data to register (register address = n) register address (n) read data from register (register address = n) slave address =0x5c (bu21072muv) =0x5d ( BU21078MUV ) slave address =0x5c (bu21072muv) =0x5d ( BU21078MUV ) register address (n) scan rate after scan each sensor in time series, mpu convert to the switch operations from the detected results. the number of sensor ports is difference between bu21072muv and BU21078MUV, but one scan rate is the same. one scan rate is about 16msec at typical. fig.11 timing chart of scan rate fig.10 2-wire serial bus protocol bu21072muv BU21078MUV sequential read random read byte write sin9 is nonexistent on BU21078MUV. sin8 is the same above. sin13 and sin14 are nonexistent on bu21072muv. sin11 and sin12 are the same above. sa : slave address ra : register address rd : read data wd : write data
8/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 power on sequence power supply pin is vdd only. avdd and dvdd are supplied by each ldo included bu21072/78muv, so that have no priority about power on sequence. when vdd reaches to the effective voltage, power-on-reset which initializes the digital block is released. power-on-reset monitoring vdd, so it should be set to proper value of decoupling capacitor and vdd rise time, so as to rise to the proper voltage (dvdd vdd). when power-on-reset is released, mpu starts initial sequence. inform by the int port to the host that the initialization has been completed. after verify that the initialization has completed, the host will need to resend the command to the ic. in the case that wdtr is released as well, mpu starts initial sequence. if wdtr has released, all registers have been initialized. so the host will need to resend the command to the ic. vdd power on reset (activelow) initialize ic about 350usec hi-z about 200usec led0-6 int interrupt of initialization done c 1 0.1uf vdd decoupling capacitor c 2 1.0uf dvdd decoupling capacitor c 3 2.2uf avdd decoupling capacitor recommended value of external capacitors over 100usec avdd vdd dvdd 2.73v 1.50v 3.30v fig.13 timing chart of power on sequence fig.12 arrangement of external decoupling capacitors fig.14 timing chart of initialization
9/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application examples bu21072muv /BU21078MUV offer two method of switch. one is simple switch, another is matrix switch. the number of the maximum matrix switches is 16 by bu21072muv, and 36 by BU21078MUV. led ports are able to be applied pwm function. pwm function offers fade-in / fade-out brightness control. bu21072 top view 16 18 13 24 19 7 12 0.1uf vdd vdd avdd 2.2uf dvdd 1.0uf vss test host scl sda int vdd 4.7k 4.7k vdd led r led4 vdd led r vdd led r led0 led1 (*1) led3 (*1) (*1) unused led pin are open. (*2) unused sin pin are open. recommended dt number : dtc143ze sin9 (*2) sin8 (*2) sin7 sin6 sin5 sin4 sin3 sin2 sin1 sin0 led5 led2 (*1) dt dt dt fig.15 application example 1 (8-simple switches, 3-leds with bu21072muv)
10/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0.1uf vdd vdd avdd 2.2uf dvdd 1.0uf vss test host scl sda int vdd 4.7k 4.7k vdd led r led6 (*1) vdd led r vdd led r led4 led2 led3 (*1) led5 (*1) led7 (*1) unused led pin are open. recommended dt number : dtc143ze sin7 sin6 sin13 sin4 sin3 sin2 sin11 sin1 sin0 bu21078 top view 1 7 21 15 28 22 8 14 led1 (*1) vdd led r led0 sin12 sin14 sin5 dt dt dt dt bu21072 top view 16 18 13 24 19 7 12 0.1uf vdd vdd avdd 2.2uf dvdd 1.0uf vss test host scl sda int vdd 4.7k 4.7k vdd led r led5 recommended dt number : dtc143ze sin9 sin8 sin7 sin6 sin5 sin4 sin3 sin2 sin1 sin0 dt vdd led r dt vdd dt led4 led3 led2 led1 led0 vdd dt vdd dt vdd led r dt led r led r led r fig.16 application example 2 (36-matrix switches, 4-leds with BU21078MUV) fig.17 application example 3 (16-matrix switches , 2-simple switches, 6-leds with bu21072muv)
11/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteristics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic's power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connected to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
12/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (12) rush current the ic with some power supplies has a capable of rush current due to procedure and delay at power-on. pay attention to the capacitance of the coupling capacitors and the wiring pattern width and routing of the power supply and the gnd lines. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
13/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information bu2107x muv -e 2 part number package muv: vqfn024v4040 vqfn028v5050 packaging and forming specification e2: embossed tape and reel line-up sensor ports package orderable part number 10ch vqfn024v4040 bu21072muv-e2 12ch vqfn028v5050 BU21078MUV-e2 physical dimension tape and reel information marking diagrams (top view) vqfn024v4040 (top view) 21072 part number marking lot numbe r 1pin mark b u vqfn028v5050 (top view) 21078 part number marking lot numbe r 1pin mark b u (unit : mm) vqfn024v4040 0.08 s s 16 7 12 19 24 13 18 0.4 0.1 0.02 +0.03 - 0.02 1pin mark 2.4 0.1 c0.2 0.5 4.0 0.1 0.75 2.4 0.1 4.0 0.1 1.0max (0.22) 0.25 +0.05 - 0.04 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) vqfn028v5050 0.08 s s 1pin mark 17 8 14 22 28 15 21 0.4 0.1 1.0 0.5 0.25 +0.05 -0.04 2.7 0.1 2.7 0.1 c0.2 5.0 0.1 5.0 0.1 0.02 +0.03 - 0.02 (0.22) 1.0max ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
14/14 datasheet d a t a s h e e t bu21072muv / BU21078MUV tsz02201-0y2y0fz00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 12.mar.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 12.mar.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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